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A:
The solution is as follows:
Download the compiler (and libraries, if needed) from
Unzip the downloaded package and copy the components /bin/macosx-xcode and/or /bin/macosx-g++ directories from the unpacked archive to the /usr/bin directory.
If compiling the library from source (at /usr/local/include/xml) instead of unzipping the archive, move it to /usr/local/include/xml.
1. Field of the Invention
The invention relates to a method of forming semiconductor devices including electrically conductive structures and metal wire interconnections including a barrier layer that includes a barrier metal having a nickel and tantalum core alloy.
2. Description of the Related Art
Thickness uniformity in the active regions of a semiconductor device is important to the performance of the device. The nonuniformity of the barrier metal thickness reduces the uniformity in the source/drain doping concentration and the silicide-to-silicide interface at the interface of the silicon substrate with the conductive layer. As a result, the characteristics of the semiconductor device, such as leakage current, device voltage range, operating speed and the like, suffer. In particular, the aspect ratio (height to width of a contact) of the contact openings increases as device dimensions decrease, which further increases the difficulty of the formation of a uniformly formed metal wire interconnection.
Referring to FIGS. 1a-d, a semiconductor device is formed. A substrate 102 is provided. A gate structure 104, including a gate dielectric layer 110 and a gate electrode 114, is formed over a portion of the substrate 102. A source/d
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